Closed Solicitation · DEPARTMENT OF COMMERCE

MICRO SPECIMENS OF ELECTROPLATED COPPER FILMS AND MICRO-SIZED LEAD-FREE SOLDER FOR MECHANICAL TESTING TO FRACTURE

Issued by NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY · DEPT OF COMMERCE NIST

Sol. NIST-SS26-CHIPS-04Sources SoughtGAITHERSBURG, MD

Closed

STATUS

Closed

closed Dec 3, 2025

POSTED

Nov 18, 2025

Publication date

NAICS CODE

541713

Primary industry classification

PSC CODE

AJ12

Product & service classification

AI Summary

The Department of Commerce's National Institute of Standards and Technology is seeking sources for micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture. Interested parties should refer to the attached Sources Sought Notice (SSN)# NIST-SS26-CHIPS-04 for complete details.

Contract details

Solicitation No.: NIST-SS26-CHIPS-04
Notice Type: Sources Sought
Posted Date: November 18, 2025
Response Deadline: December 3, 2025
NAICS Code: 541713 AI guide
PSC / Class Code: AJ12
Issuing Office: DEPT OF COMMERCE NIST
Sub-Agency: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Agency: DEPARTMENT OF COMMERCE
Primary Contact: Nina Lin
City: GAITHERSBURG
State: MD
ZIP Code: 20899
AI Product/Service: both

Description

Please see attached Sources Sought Notice (SSN)# NIST-SS26-CHIPS-04 for full details.

Key dates

November 18, 2025Posted Date
December 3, 2025Proposals / Responses Due

AI search tags

electroplated copper films lead-free solder mechanical testing materials testing research services

Frequently asked questions

MICRO SPECIMENS OF ELECTROPLATED COPPER FILMS AND MICRO-SIZED LEAD-FREE SOLDER FOR MECHANICAL TESTING TO FRACTURE is a federal acquisition solicitation issued by DEPARTMENT OF COMMERCE. Review the full description, attachments, and submission requirements on SamSearch before the response deadline.

SamSearch Platform

Stop searching. Start winning.

AI-powered intelligence for the right opportunities, the right leads, and the right time.

Book a Demo