MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

AI Summary

The National Aeronautics and Space Administration (NASA) has issued a special notice regarding a sole source requirement for the multi-chip module packaging of silicon carbide (SiC) pressure sensors and electronics. This opportunity is classified under NAICS Code 334419. The notice was published on August 23, 2024, at 9:00 AM (Eastern Time). Potential bidders should note that this is a sole source requirement, indicating that NASA intends to procure these services from a specific vendor rather than through a competitive bidding process.