REQUEST FOR INFORMATION: NEXT GENERATION MICROELECTRONICS MANUFACTURING 3DHI MICROSYSTEMS

AI Summary

The Defense Advanced Research Projects Agency (DARPA) is seeking information through a Request for Information (RFI) to support the development of next generation 3D heterogeneously integrated microsystems. This initiative aims to identify innovative applications and potential barriers in utilizing the Next Generation Microelectronics Manufacturing capabilities. Interested organizations are encouraged to respond to this RFI.

Contract details

Solicitation No.: DARPA-SN-25-93
Notice Type: Special Notice
Posted Date: July 25, 2025
Response Deadline: August 29, 2025
NAICS Code: 541715 AI guide
PSC / Class Code: AC12
Issuing Office: DEF ADVANCED RESEARCH PROJECTS AGCY
Sub-Agency: DEFENSE ADVANCED RESEARCH PROJECTS AGENCY
Agency: DEPT OF DEFENSE
Primary Contact: MTO BAA Coordinator
City: ARLINGTON
State: VA
ZIP Code: 222032114
AI Product/Service: service

Description

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information to support a future solicitation. This “Design Challenge” solicitation is intended to advance the next generation of 3D heterogeneously integrated (3DHI) microsystems by enabling early access to the capabilities established under the Next Generation Microelectronics Manufacturing (NGMM) program. The prototypes developed through this effort will demonstrate the unprecedented performance of 3DHI microelectronics. Through this RFI, DARPA aims to solicit further insight into the classes of 3DHI microsystems that can best leverage the NGMM integration technology roadmap to support innovative commercial and/or dual use applications.

The goals of this Request for Information (RFI) include, but are not limited to:
• Identification of innovative applications that can leverage 3DHI
• Identification of organizations interested in utilizing NGMM’s 3DHI capability
• Identification of potential barriers to fabricating 3DHI components
• Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM

Key dates

July 25, 2025Posted Date
August 29, 2025Proposals / Responses Due

AI search tags

microelectronics manufacturing 3d microsystems defense research technology development innovation

Frequently asked questions

REQUEST FOR INFORMATION: NEXT GENERATION MICROELECTRONICS MANUFACTURING 3DHI MICROSYSTEMS is a federal acquisition solicitation issued by DEPT OF DEFENSE. Review the full description, attachments, and submission requirements on SamSearch before the response deadline.