Active Solicitation · DEPT OF DEFENSE

    SEMICONDUCTOR DIE BONDING AND VACUUM PACKAGING SYSTEM

    Sol. N00173-26-RFI-KN02Sources SoughtWASHINGTON, DC
    Open · 8d remaining
    DAYS TO CLOSE
    8
    closes Jul 1, 2026
    POSTED
    Jun 17, 2026
    Publication date
    NAICS CODE
    334413
    Primary industry classification
    PSC CODE
    Product & service classification

    AI Summary

    The Department of the Navy is seeking industry input for a Semiconductor Die Bonding and Vacuum Packaging System. This Sources Sought Notice aims to assess market capabilities and does not constitute a solicitation. Interested parties should provide a Capability Statement detailing their qualifications and relevant resources.

    Contract details

    Solicitation No.
    N00173-26-RFI-KN02
    Notice Type
    Sources Sought
    Posted Date
    June 17, 2026
    Response Deadline
    July 1, 2026
    NAICS Code
    334413AI guide
    Primary Contact
    KEVIN NGUYEN
    State
    DC
    ZIP Code
    20375-5328
    AI Product/Service
    both

    Description

    NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time.

    OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications.

    CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response)

    1. CONTACT INFORMATION 

      a) Company Name and Address

      b) Point of Contact for question/clarification

      c) Telephone Number and e-mail address

      d) Unique Entity ID and CAGE Code  

      e) PSC Code of the proposed solution (SEE https://psctool.us)

      f) Business Size/Socioeconomic Categories

    2. TECHNICAL INFORMATION:

    a) List of capabilities/resources relevant to the attached specifications.

    b.) Any questions/suggestions related to the Specifications

    3. COMMERCIALITY OF PROPOSED ITEM

    a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes.

    b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item.

    c) If the manufacturer of the component, please confirm if Authorized Resellers are available.

    ADDITIONAL REQUIREMENT DETAILS:

    Responses should be no more than 10 pages and should be emailed to the Contract Specialist at
    kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil. 

    Key dates

    1. June 17, 2026Posted Date
    2. July 1, 2026Proposals / Responses Due

    AI search tags

    Frequently asked questions

    SEMICONDUCTOR DIE BONDING AND VACUUM PACKAGING SYSTEM is a federal acquisition solicitation issued by DEPT OF DEFENSE. Review the full description, attachments, and submission requirements on SamSearch before the response deadline.

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