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Contract Category
1 federal contract opportunities classified as Flip Chip Bonder Maintenance.
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
AI Summary
NASA's National Space Science Center (NSSC) is seeking bids for a maintenance service contract for the FC150 and FC300 flip chip bonders. This opportunity falls under NAICS Code 541990 and is designated as a Small Business Administration set-aside. Interested bidders should refer to the attached Statement of Work (SOW)…
Common questions about finding and winning Flip Chip Bonder Maintenance government contracts.