Wafer Bonding Government Contracts

AI Summary

The Department of Commerce's National Institute of Standards and Technology has issued a Sources Sought Notice of Intent to Sole Source for a closed fixture for the SUSS Wafer Bonder. This opportunity is focused on specialized manufacturing equipment and is categorized under NAICS code 333242.

AI Summary

The National Institute of Standards and Technology (NIST) is seeking responses for a universal SiC closed fixture for a SUSS wafer bonder. This sources sought notice aims to identify potential suppliers capable of meeting specific technical requirements for wafer bonding processes. Interested parties should respond wit…

AI Summary

The Department of Defense's DARPA is seeking innovative solutions for wafer bonding technologies and algorithms to enhance the integration of bonded single crystal thin films into multi-functional materials. This solicitation aims to address the lack of predictive models in wafer bonding processes, which currently rely…