Closed Solicitation · DEPARTMENT OF COMMERCE
AI Summary
The Department of Commerce's National Institute of Standards and Technology is seeking proposals for an automatic wire bonder. The equipment must bond chips to a 256-pin ceramic package and include inspection tools. Interested vendors should refer to the attached Combined Synopsis Solicitation and Statement of Work for detailed requirements.
AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:
Vendor Question 1:
Can you let me know if the parts will be held on flat boats or manually placed on the workholder?
NIST Response:
The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.
Vendor Question 2:
Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?
NIST Response:
No
Vendor Question 3:
Application: What type of bonding applications do you plan to run with the new wire bonder?
NIST Response:
We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process
Vendor Question 4:
Bonding Tools: Are there specific bonding tools or configurations required for your applications?
NIST Response:
You will find this information in the Statement of Work.
Vendor Question 5:
Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?
NIST Response:
The tool should contain a scope for inspection and a way to fix the sample piece to the stage.
As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses
AMENDMENT 1 TO AUTOMATIC WIRE BONDER is a federal acquisition solicitation issued by DEPARTMENT OF COMMERCE. Review the full description, attachments, and submission requirements on SamSearch before the response deadline.
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