NOTICE OF INTENT TO NONCOMPETITIVELY ACQUIRE ENVIRONMENTAL CHAMBER

This notice is not a request for a quotation. A solicitation document will not be issued and quotations will not be requested.

This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334513.

The National Institute of Standards and Technology (NIST), CHIPS Metrology Program is tasked with providing the semiconductor industry with measurement capabilities, knowledge, and open-source data for polymeric materials that are used in next-generation packaging technologies. To support this responsibility, this project is seeking a customized environmental chamber for film stress measurements.

Thermosets used in semiconductor applications exhibit complex cure kinetics that are highly affected by the processing parameters (i.e., temperature, humidity). Furthermore, these thermoset materials are cured in thin film geometries, where residual stress development during processing may significantly affect the performance and lifetime of the cured material. This project aims to quantify the residual stress development in thin thermoset films during processing and service.  The thermoset film will be coated onto a stiff, reflective, and thin (approximately 100 μm – 300 μm thick) cantilever (approximately 100 mm × 6 mm planar dimensions) that will bend in response to cure shrinkage and hygrothermal  expansion/contraction. The stress development in the film will be calculated by measuring the curvature of the cantilever sample using a normal incidence laser array that is reflected off the uncoated side of the cantilever. The thermal uniformity across the thin film will be measured using an infrared camera. The thermal environment around the cantilever sample will be achieved using a programmable environmental chamber with customized ports to enable concurrent laser and infrared camera measurements. These ports must be located on the top and bottom of the chamber to enable observation of a horizontal cantilever, which ensures uncured (i.e., liquid) material does not flow off of the cantilever. Additional ports will be required for added measurement capabilities, such as controlling the relative humidity of the environment.

NIST requires a customized environmental chamber to integrate into the stress bench measurement system that NIST is building to quantify in-situ stress generation in polymeric resins that are used in semiconductor packaging. The primary function of the requested chamber will be to integrate the relevant thermal and relative humidity environment experienced by the packaging material during the thermal curing process and (post-cure) under service conditions. We anticipate that the results from the completed stress measurement platform, with a customized chamber, will elucidate the relationship between processing and performance in advanced packaging materials. Measurements will feed into existing predictive models used by the semiconductor community to improve the accuracy of the output and potentially shorten the development process for introducing new and innovative materials into the advanced packaging workflow.

The Chamber shall meet the following specifications:

Physical requirements

1. Internal volume: 700 in3 or less
2. Internal dimensions: Shortest dimension must be greater than or equal to 5 in.
3. Net weight ≤ 100 lbs
4. Temperature range
   1. Minimum temperature of at least: −55 °C
   2. Maximum temperature of at least: 300 °C
5. Programmable ramp rate: 2 °C/min to 30 °C/min
6. Programmable cooling rate: 2 °C/min to 30 °C/min
7. The base oven (before any customization to include ports) should achieve the following chamber uniformity and stability specifications
   1. Temperature resolution ≤ 0.05 °C
   2. Absolute error ≤ +/- 0.5 °C
   3. Long term stability ≤ +/- 0.5 °C
   4. The vendor must provide information on temperature uniformity and temperature control accuracy of the chamber after customization.
8. The chamber must include two ports that are positioned directly opposite each other on the top and bottom of the chamber
   1. Bottom port for laser access: 4 in diameter
      1. 4 silicone plugs should be included to block the port.
      2. Note: After delivery, NIST plans to drill holes into the plugs to enable laser access.
   2. Top port to allow IR camera observation: 2 in diameter
      1. Top port must be covered by an infrared transparent window to allow for mid-wave infrared imaging (wavelengths = 3 microns to 5 microns)
      2. Must include some mechanism to cover the infrared window when it is not in use. Examples of appropriate mechanisms include using a shield or silicone plug.
      3. The infrared transparent window must be removable in case there is a need to replace the part.
9. The chamber must include a glass window/viewport in the side wall that is adjacent to the door.
10. Input port for Nitrogen gas (or other inert gas) purge
11. Input port for humidified gas to enable humidity control
    1. Hole size: 1 in
    2. Include silicone plug for the hole
    3. Mount removable, barbed, and humidity compatible on/off valve over the hole
    4. Position port on the side wall of the chamber
12. Input port to accommodate thermocouples and humidity sensor cables (port hole ≤ 1 in diameter)
    1. Include silicone plug for this port
13. Must operate from a NEMA 5-15R (standard US outlet)

Temperature monitor and controller

The temperature chamber must include a temperature monitor and controller that meets the following requirements:

1. Control over dwell times must be included.
2. Programmable temperature control must include the capability to loop and nest commands/steps.
3. The controller must allow programming using the human-machine interface on the oven.
4. Additionally, the controller must include an interface to be remotely operated/programmed by transferring commands/steps using a personal computer running Windows 11.
   1. A control computer is not required. NIST will use its own computer to control the oven.
   2. Cables needed to connect to a computer must be provided or the equipment needed must be specified.
5. Must include an over temperature thermostat.
6. Must include an upper and lower temperature limit within the software.

NIST conducted market research in November 2024 through February 2025 via internet research, GSA searches, speaking to colleagues, company searches, and a sources sought notice on SAM.gov with only one response. Based on this research it was found that only The Research Foundation for the State University of New York (UEI: NQMVAAQUFU53) could provide a product that meets all technical requirements.

However, any sources that believe they are capable of meeting NIST’s minimum requirements are encouraged to respond to this notice by the response date to provide the following information at a minimum: Company Unique Entity Identifier number in https://sam.gov; details about what your company is capable of providing that meets or exceeds NIST’s minimum requirements; whether your company is an authorized reseller of the product or service being cited and evidence of such authorization; and any other information that can help NIST determine whether this requirement may be competitively satisfied.