REQUEST FOR INFORMATION (RFI) TITLE: MOUNTED MISSION COMMAND (MMC) MOUNTED FAMILY OF COMPUTER SYSTEMS (MFOCS) BLOCK III MARKET RESEARCH QUESTIONNAIRE FOR INDUSTRY COMMENT

The Mounted Family of Computer Systems (MFoCS) Block I and II is a modular family of Tactical Mounted Common Computing Hardware that enables Mission Command interoperability through a family of common Line Replaceable Units (LRUs) that are scalable and tailorable to the mission and vehicle, while reducing weight, size, and power demands from previous legacy computers.

The MFoCS hardware is installed in tactical and combat ground vehicles and provides a modular family of common computing LRUs with multiple levels of processing and display hardware. The MFoCS system design allows for incremental/incidental technology and capability upgrades to be retrofitted into the system via updated LRUs to ensure compatibility with existing cables, mounts, and fielded LRUs.

The MFoCS hardware is ruggedized for use in military environments and is capable of continuous operation over the full set of operational environmental conditions (temperature, shock, vibration, water ingress, nuclear effects, chemical and biological decontamination, etc.).

The Government intends to replace the Block I and II systems with modernized Block III computers further reducing size, weight, and cost.

The Government intends to replace the existing processor and display configuration (commonly known as ‘MFoCS Intermediate’), and the “tablet” based (commonly known as ‘MFoCS Basic’) Logistics and Tactical Operations Center (TOC) systems with an All-In-One (AIO) (aka Smart Display) solution for a majority of the Army’s wheeled platforms. 

The Government intends to replace the current “headless” processor unit with an upgraded (processing power, memory, etc.) processor unit in the integrated/firing platforms.

The Government is requesting information from industry to inform its future acquisition strategy, and technical requirements in preparation for a potential future MFoCS Block III  Request for Proposals. 

1. Describe the size, weight, power, and cost savings opportunities by reducing the footprint to an all-in-one computer.
2. Describe the likelihood of utilizing the existing MFoCS Block I/II installation kits, or the need for Block III adapter cables to connect to legacy installation kits.  Describe innovative ways to reduce size/weight while maintaining form fit and function backwards compatibility with MFoCS Block I/II.
3. Please describe concerns with heat or power with the all-in-one form factor.
4. Describe supply chain concerns and mitigations.
5. Describe innovative ways to reduce cost while maintaining backwards compatibility.
6. Describe obsolescence mitigation strategy or new ways to mitigate obsolescence.
7. Describe a refresh schedule for addressing obsolescence while maintaining a long-term configuration baseline minimizing sustainment burden.
8. Describe supply chain risk mitigation strategies.
9. Describe the approach to selecting a microprocessor that supports the computing resource demand, manages heat, and future growth.
10. Describe approach and risks to meeting environmental requirements to include shock, vibration, hot and cold environments, etc.
11. Describe approach to elimination of internal CMOS batteries or utilizing a user replaceable battery.
12. Describe advantages and disadvantages of internal vs external GPS (e.g. MAPS, DAPS, etc.)
13. Describe any off-the-shelf computer solutions that may be a solution for Block III.
14. Describe minimal sustainment rates for production lines.
15. Describe a schedule for completing First Article Test and lead time to initial production deliveries.
16. Describe the cost drivers for a rugged tactical computer.
17. Provide anticipated costs for an all-in-one and headless form factor computers in the range quantity

A.  1-49

B.  50-99

C.  100-249

D.  250-499

E.  500-999

F.  1000-2999

G.  3000-4999

H.  5000-9999

I.  10000-14999

J.  15000+

All technical data provided as part of this RFI is Controlled Unclassified Information (CUI).  Contractors are required to fill out a CUI Non-disclosure form prior to receiving technical information. 

Export-controlled technical information marked with Distribution Statement C or D will not be distributed outside the U.S. Government or to U.S. Government contractors without first verifying the recipient’s eligibility and authority to receive export-controlled technical information by verifying that they have a current, valid Department of Defense Form 2345, “Militarily Critical Technical Data Agreement,” available on the DoD Forms Management Program Website at https://www.esd.whs.mil/Portals/54/Documents/DD/forms/dd/dd2345.pdf, in accordance with DoDD 5230.25.

All technical information provided as part of this RFI will be provided via encrypted files through DoD SAFE.

RFI Feedback:

After the Government reviews all vendor submissions there may be additional need for further follow-on questions. If so, the Government will contact each vendor to ask these follow-on questions on an individual basis. 

All information must be submitted and received no later than 1700EST 26 April 2024.  RFI response submissions and other technical documentation shall be submitted back to the Government via encrypted DoD SAFE drop. 

This is a market survey requesting information only. The submission of this information is for planning purposes and is not to be construed as a commitment by the Government to procure any items/services, or for the Government to pay for the information received. No solicitation will be issued against this notice.

Questions should be send to James.m.mabrey.civ@army.mil by COB 10 April 2024.