Closed Solicitation · DEPT OF DEFENSE
AI Summary
The U.S. Army Combat Capabilities Development Command is issuing a Special Notice for the RESHAPE 2.0 initiative, focusing on developing a domestic advanced packaging ecosystem. This opportunity is limited to Cornerstone Consortium members and aims to address gaps in the microelectronics supply chain. Interested parties must meet specific eligibility criteria and stay updated on potential changes.
U.S. Army Combat Capabilities Development Command – Chemical Biological Center (DEVCOM CBC), Rock Island, IL, on behalf of the Office of the Secretary of Defense, Office of the Assistant Secretary of Defense for Industrial Base Policy Innovation Capability and Modernization office via its Industrial Base Analysis and Sustainment (IBAS) Program (10 U.S.C. § 4817), in conjunction with Army Contracting Command - Rock Island Arsenal (ACC-RIA), manages the Cornerstone Other Transaction Agreement (OTA), in accordance with 10 U.S.C. § 4022. Cornerstone was architected to create a broad-based, flexible and enduring public-private consortium focused on strategic strengthening of the U.S. Manufacturing and Defense Industrial Base and provide a strong complement to the mandates in Presidential Executive Order 13806.
ACC-RIA, on behalf of DEVCOM CBC and the Department of War (DoW), intends to issue a competitive Cornerstone Initiative Request (CIR) for Reshore Enhanced Secure Heterogenous Advanced Packaged Electronics (RESHAPE) 2.0 on or after 29 May 2026, with an estimated closing date of 30 days after issuance. The CIR for RESHAPE 2.0 is restricted to Cornerstone consortium members.
Subject to funding, the Cornerstone CIR will solicit prototype fixed-price proposals for multiple (4 to 10) Other Transaction Agreements (OTA) with incremental payments made upon completion of specific milestones. The period of performance is estimated to be 60 months. A non-competitive follow-on production OT may be awarded following a successful prototype.
Objective:
The objective of this effort is to develop a U.S.-owned, domestic, trusted, pure-play, and open-access Advanced Packaging Ecosystem Hub. This hub will focus on low-volume production of 2.5-D and 3-D Advanced System Integration and Packaging (ASIP) secure solutions. This initiative seeks to address critical gaps in the domestic microelectronics supply chain, reduce reliance on offshore manufacturing, and enhance the mission effectiveness of Department of War (DoW) systems.
Any OT awarded as a result of this initiative will incorporate the following clauses:
The CIR is restricted to Cornerstone Consortium members only and will be communicated to the Cornerstone Consortium and companies with pending applications via email. Entities are required to have begun the membership process for their proposal to be reviewed. Entities must have an active registration in SAM.gov, a favorable status in Federal Awardee Performance and Integrity Information Systems, and be members of the Cornerstone Consortium, with a signed Cornerstone Consortium Management Agreement, to be eligible to submit a proposal and be eligible for awarded this of an OTA task. Contractors may obtain Cornerstone registration information located at https://cornerstone.army.mil or by inquiring at: usarmy.ria.devcom-cbc.mbx.cornerstone-ota@army.mil.
Interested parties should stay alert for any changes that may be published to this sam.gov posting. Please email all questions and responses to the following mailbox: usarmy.ria.devcom-cbc.mbx.cornerstone-ota@army.mil
This Special Notice is for planning purposes only and does not constitute a CIR or an obligation on behalf of the U.S. Government. Issuance of this Special Notice is not a guarantee of a future CIR or an award and is not a commitment of any kind by the Government.
RESHAPE 2.0 is a federal acquisition solicitation issued by DEPT OF DEFENSE. Review the full description, attachments, and submission requirements on SamSearch before the response deadline.
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