What types of agencies buy Advanced Packaging services?

Federal agencies across all departments procure Advanced Packaging services, including the Department of Defense, Department of Veterans Affairs, General Services Administration, and civilian agencies. State and local governments also issue Advanced Packaging contracts through their own procurement portals.

How do I find Advanced Packaging contracts with SamSearch?

Use SamSearch to browse pre-classified opportunities in one place, with AI-powered filtering by agency, set-aside, and deadline.

Are there set-aside contracts for small businesses in Advanced Packaging?

Yes. Many Advanced Packaging contracts are set aside for small businesses, including 8(a), WOSB, SDVOSB, and HUBZone firms. Use SamSearch's set-aside filters to find contracts your business qualifies for.

How competitive are Advanced Packaging government contracts?

Competition varies by contract size and type. Large IDIQ vehicles in Advanced Packaging can attract dozens of bidders, while small open-market solicitations may have only a few. Monitoring active solicitations and building agency relationships early improves win rates.

Contract Category

Advanced Packaging Government Contracts

7 government contract opportunities classified as Advanced Packaging. Updated daily.

6 federal1 forecastsUpdated daily

Federal Opps

Federal contracts

SLED Opps

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State, local & education contracts

Forecasts

Agency pipeline forecasts

Total

All sources combined

6 federal contract opportunities classified as Advanced Packaging.

DEPARTMENT OF COMMERCE

SOLE SOURCE JUSTIFICATION FOR TEST VEHICLE TO STUDY RELIABILITY OF MATERIALS USED IN ADVANCED PACKAGING OF SEMICONDUCTOR CHIPS

Archived

AI Summary

The Department of Commerce's National Institute of Standards and Technology is seeking a sole source justification for a test vehicle to study the reliability of materials used in advanced packaging of semiconductor chips. This opportunity is available for 30 days and includes a redacted justification for other than fu…

Posted Dec 23, 2025JustificationNAICS 334516Sol: 1333ND26PNB030001JOFOC

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DEPARTMENT OF COMMERCE

CHIPS R&D: Extreme Thermal Cycling Chamber Combined Sources Sought/Notice of Intent to Sole Source

Archived

AI Summary

The National Institute of Standards and Technology is seeking an Extreme Thermal Cycling Chamber for accelerated aging experiments in semiconductor packaging. This Source Sought notice invites responses from potential suppliers capable of meeting specific technical requirements for the chamber, which is crucial for adv…

Posted Dec 12, 2025Due Dec 26, 2025Special NoticeNAICS 334519Sol: NIST-SS26-CHIPS-49

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DEPARTMENT OF COMMERCE

Sources Sought Notice for CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Archived

AI Summary

The National Institute of Standards and Technology is seeking sources for a high-throughput high-resolution X-ray laminography/tomography system for semiconductor devices. The system must meet specific resolution and scan speed requirements and include automation for sample handling. Interested manufacturers should res…

Posted Nov 20, 2025Due Dec 5, 2025Sources SoughtNAICS 334413Sol: NIST-SS26-CHIPS-14

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DEPT OF DEFENSE

DEPARTMENT OF THE AIR FORCE/ASSISTANT SECRETARY OF THE AIR FORCE (ACQUISITION) (SAF/AQ) Request For Information Defense Industrial Base (DIB) interest in using Secure Enclave (SE)

Archived

AI Summary

The Department of the Air Force is seeking industry input through a Request for Information (RFI) regarding the use of Intel's 18A microelectronics technology for advanced applications. A Reverse Industry Day (RID) will take place on June 17, 2025, in Northern Virginia, with optional one-on-one sessions on June 18. Par…

Posted May 29, 2025Due Jun 7, 2025Special NoticeSol: FA7146-25-R-RFI1

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DEPT OF DEFENSE

STRENGTHENING AMERICAS MANUFACTURING AND DEFENSE INDUSTRIAL BASE

Archived

AI Summary

The U.S. Army Combat Capabilities Development Command - Chemical Biological Center (DEVCOM CBC) is issuing a special notice regarding the Strengthening America's Manufacturing and Defense Industrial Base initiative, managed in collaboration with the Office of the Secretary of Defense. This initiative aims to enhance th…

Posted Nov 27, 2024Special Notice

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DEPT OF DEFENSE

SILICON CARBIDE ADVANCED PACKAGING OF POWER SEMICONDUCTORS II

Archived

AI Summary

The U.S. Army is seeking information on advanced packaging technologies for power semiconductors, specifically silicon carbide solutions. This opportunity is part of a special notice aimed at enhancing semiconductor capabilities for defense applications. Interested parties should respond to this Source Sought notice.

Posted Sep 6, 2017Due Oct 7, 2017Special NoticeSol: W911NF17S0003-SCAPOPS

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