SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS

All correspondence should reference Notice ID 80NSSC26925189Q in the subject line.

Synopsis:

NASA/NSSC has a requirement for Silicon Nitride for sensor packaging for high temperature applications. 

NASA/NSSC intends to issue a sole source contract to SIENNA TECHNOLOGIES, INC. 11611 49TH PL W Mukilteo, Washington 98275 United States under the authority of FAR 13.106-1(b)(1)(i). It has been determined that SIENNA TECHNOLOGIES, INC. is the sole provider of Silicon Nitride for sensor packaging for high temperature applications

NASA/NSSC will be the procuring center for this effort.  Performance will be located at NASA/ Glenn Research Center (GRC).

The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13.

The NAICS Code for this procurement is 541715.

Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 4:00 p.m. Central Standard Time on 2/25/2026. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.

Oral communications are not acceptable in response to this notice.

NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html .

Primary Point of Contact:

Laura Quave

Procurement Specialist

laura.a.quave@nasa.gov

228-813-6420