SamSearch Platform
AI-powered intelligence for the right opportunities, the right leads, and the right time.
Contract Category
2 federal contract opportunities classified as Packaging Technology.
AI Summary
The National Institute of Standards and Technology is seeking proposals for a high-throughput high-resolution x-ray laminography/tomography system for advanced packaged semiconductor devices and substrates. The response deadline is March 9, 2026. Vendors must provide sample carriers compatible with the automated loadin…
MD
AI Summary
The Department of the Air Force is seeking industry input through a Request for Information (RFI) regarding the use of Intel's 18A microelectronics technology for advanced applications. A Reverse Industry Day (RID) will take place on June 17, 2025, in Northern Virginia, with optional one-on-one sessions on June 18. Par…
DC
Common questions about finding and winning Packaging Technology government contracts.